From 1997 onwards, Groz-Beckert has consistently taken steps into a new field with its CPC or ceramic punching components product area. Diversification and the additional benefits of synergy effects were the force behind the successful development of this product area. It is most particularly a wealth of expertise in research and development, but also a recognition of our strength in the production of miniature quality products and the world-wide presence of the company that are responsible for the success of Groz-Beckert products in the field of micro-electronics.

Ceramic punching components are needed in the production of ceramic substrate carriers. These ceramic carriers for microchips of all kinds, usually consisting of several layers, are used to construct complex multi-chip modules. These can be found, for example, in the control technology of cars or in many electronic appliances we use every day.

The development of ceramic substrate carriers has made it possible to create strong and particularly reliable connections between different components – an ideal area of application for the expertise in precision engineered quality products that is available within the Groz-Beckert Group.

All components are 'customised' in close dialogue with machine builders and users. Complex carbide tools, stamps, matrices, guide bushings and cutting elements are part of the individual product range in this sector.

CPC - Innovations